Cubic (Beta) SiC powder sub-micron size 0.5um for thermal conductive

Polymer materials have the advantages of low density, easy processing, and good electrical insulation. They are widely used in fields such as microelectronics integration and packaging, electrical machinery, and LED energy saving. Generally speaking, polymers are poor conductors of heat. As far as insulating materials are concerned, their heat dissipation capacity is becoming a bottleneck problem, and there is an urgent need to prepare high thermal conductivity polymer composite materials with excellent comprehensive properties.

Silicon carbide has the characteristics of corrosion resistance, high temperature resistance, high strength, good thermal conductivity, impact resistance, etc. At the same time, it has the advantages of high thermal conductivity, oxidation resistance, and good thermal stability.

The researchers used silicon carbide as a thermal conductive filler to fill epoxy, and found that nano-silicon carbide can promote the curing of epoxy resin, and silicon carbide particles are more likely to form a thermal conduction path or thermal network chain inside the resin system, reducing the internal void ratio of epoxy resin and improving epoxy resin. The mechanical and thermal conductivity of the material.

Some studies have used silane coupling agent, stearic acid and their combination as modifiers to study the effects of different modifiers on the solid content, oil absorption value and thermal conductivity of β-SiC powder. The experimental results show that the modification effect of KH564 in the silane coupling agent is more obvious; through the study of stearic acid and the combination of the two surface modifiers, the results show that the modification effect is further improved compared with the single modifier, and the hardness is higher. The effect of fatty acid and KH564 is better, and the thermal conductivity reaches 1.46 W/(m·K), which is 53.68% higher than that of unmodified β-SiC and 20.25% higher than that of single KH564 modification.

Above for your reference only, details would needs your testing, thanks.