| TDSSize | 40nm | 70nm | 100nm | 200nm |
| Morphology | Spherical | |||
| Purity | Metal basis 99.9% | |||
| COA | Bi<=0.003% Sb<=0.001% As<=0.002% Sn<=0.001% Fe<=0.006% Ni<=0.005% Pb<=0.001% Zn<=0.002% | |||
| SSA(m2/g) | 10-12 | 8-11 | 8-10 | 6-8 |
| Bulk Density(g/ml) | 0.19 | 0.20 | 0.21 | 0.22 |
| True Density(g/ml) | 8.9 | 8.9 | 8.9 | 8.9 |
| Packing size | 25g,50g,100g per bag in double antistatic bags, or as required. | |||
| Delivery time | In stock, shipping in two work days. | |||
Acts as an anti-biotic, anti-microbial, and anti-fungal agent when added to plastics, coatings, and textiles.
High strength metals and alloys.
EMI shielding.
Heat sinks and highly thermal conductive materials.
Efficient catalyst for chemical reactions and for the synthesis of methanol and glycol.
As sintering additives and capacitor materials.
Conductive inks and pastes containing Cu nanoparticles can be used as a substitute for very expensive noble metals used in printed electronics, displays, and transmissive conductive thin film applications.
Superficial conductive coating processing of metal and non-ferrous metal.
Production of MLCC internal electrode and other electronic components in electronic slurry for the miniaturization of microelectronic devices.
As nanometal lubricant additives.
Copper nanoparticles(20nm bta coated Cu) should be sealed in vacuum bags.
Stored in cool and dry room.
Do not be exposure to air.
Keep away from high temperature, sources of ignition and stress.