| Stock# | Size | Bulk Density (g/ml) | Tap Density (g/ml) | SSA(BET) m2/g | Purity % | Morpholgoy |
| HW-SB115 | 1-3um | 1.5-2.0 | 3.0-5.0 | 1.0-1.5 | 99.99 | Spherical |
| HW-SB116 | 3-5um | 1.5-2.5 | 3.0-5.0 | 1.0-1.2 | 99.99 | Spherical |
| Note:Other specifications can be customized according to requirements, please tell us the detailed parameters you want. | ||||||
Conductive Composites
Silver nanoparticles conduct electricity and they are easily dispersible in any number of other materials. Adding silver nanoparticles to materials such as pastes, epoxies, inks, plastics, and various other composites enhance their electrical and thermal conductivity.
1. High-end silver paste (glue) :
Paste (glue) for internal and external electrodes of chip components;
Paste (glue) for thick film integrated circuit;
Paste (glue) for solar cell electrode;
Conductive silver paste for LED chip.
2. Conductive Coating
Filter with high-grade coating;
Porcelain tube capacitor with silver coating
Low temperature sintering conductive paste;
Dielectric paste
Photovoltaic IndustryConductive spherical silver powder of high performance metal for solar cell silver electrode slurry
The silver electronic paste for the positive electrode of silicon solar cell is mainly composed of three parts:
1. Ultrafine metallic silver powder for conducting electricity. 70-80 wt %. It has high photoelectric conversion efficiency.
2. Inorganic phase that solidifies and helps melt after heat treatment. 5-10wt%
3. Organic phase that acts as a bond at low temperature. 15-20wt%
The superfine silver powder is the main component of the silver electronic slurry, which eventually forms the electrode of the conductive layer. Therefore, particle size, shape, surface modification, specific surface area and tap density of silver powder have great influence on slurry properties.
The size of silver powder used in silver electronic slurry is generally controlled within 0.2-3um, and its shape is spherical or nearly spherical.
If the particle size is too large, the viscosity and stability of the silver electronic paste will be significantly reduced, and because of the large gap between the particles, the sintered electrode is not close enough, the contact resistance increases significantly, and the mechanical properties of the electrode are not ideal.
If the particle size is too small, it is difficult to mix evenly with other components in the preparation process of silver paste.